Application Number: 201010023017.0；

Abstract: A new preparation for PA/PC alloy with high temperature resisitance was disclosed. The method includes the following steps:(1) Polyamide(PA)66, polycarbonate(PC) were dried at 90℃ for 12 hours in at high frequency-vacuum and dehumidification drying. The mass ratio of Polyamide(PA)66, polycarbonate(PC), silicone rubber and the organic modified montmorillonite (OMMT) is 100:(5-15):(5-15):(0-1).(2) the mixers were extruded by two-screw extrusion and cut into pellets. The extrusion temperature is 265-300 ℃, the speed of the screw is 50-100r/min. The detention time of the preparation process was 120-400s.Compared with conventional techniques, the patens prepared the PA66 with excellent mechanic properties and high temperature resistance.