Writer: Wei Wu, Yong Liu, Yu Chen, Mingchang Liu, Pinpin Shi, Xiang Wu
Publication: China Plastics Industry. 2011, 39 (7): 24-27
Abstract: Liquid and solid epoxy resin were mixed． DDS was used as the curing agent and polyamic acid (PAA) was added to modified the resin matrix．Epoxy resin film was prepared using method of scraping membrane．The effects of solid-to-liquid ratio of epoxy and the amount of PAA on film forming ability ,curing temperature and curing rate were studied by means of DSC，plate-wire。Drawing method and FTIR．The reaction mechanism of PAA on the curing reaction” epoxy/DDS system was explored as well．The result showed that adding PAA into the resin matrix can improve the toughness of epoxy resin film，reduce the curing temperature and acceleate the curing rate． For this resin system (the mass ratio of solid epoxy to liquid epoxy was 50:50)， while the amount of PAA was 5wt％，the initial curing temperature was descended from175.9℃ to 138.8℃and the gel time was descended from 162 min to 46 min．The resin systemn was tumed from high temperature system into nedy medium temperature system．
