Writer: Wei Wu , Mingchang Liu, Yu Chen, Weiguang Pu, Xiang Wu
Publication: Acta Materiae Compositae Sinica, 2011,28(4): 1-6
Abstract: The cure reaction kinetics of E- 51 epoxy resin and 4, 4-diamino diphenyl sulfone (DDS) system was investigated by the isothermal DSC method, and isothermal curing kinetics parameters at 170, 180, 190, 200℃ were obtained through fitting between the experimental data and the curing model. According to the values of coefficient of determination (R2) of the fitted data, a suitable curing reaction kinetic model was determined. The reaction process shows to be dominated by different mechanism at different stages of the E- 51/DDS system curing process, when the cure degree is less than 40%, the curing system is Kamal autocatalytic reaction model; when the cure degree is more than 40%, the curing system is nth order reaction model, with an initial autocatalytic reaction shifting into an nth order reaction as the reaction proceeding.
