Writer: Yong Liu,Wei Wu,Yu Chen,Mingchang Liu.

Publication:  Journal of Applied Polymer Science, 2013,127(4)：3213-3220

Abstract: A thermoplastic modification method was studied for the purpose of improving the tough ness and heat resistance and decreasing the curing temperature of the cured epoxy/4, 40-diaminodiphenyl sulfone resin system. A polyimide precursorpolyamic acid (PAA) was used as the modifier which can react with epoxy. The effects of PAA on curing temperature, thermal stability and mechanical properties were investigated. The initial curing temperature (Ti) of the resin with 5 w t % PAA decreased about 50℃. The onset temperature of thermal decomposition and 10 wt %-weight-loss temperature for the resin system containing 2wt % PAA increased about 60℃ and 15℃respectively. Besides, the value of impact toughness and plain strain fracture toug hness for the modified epoxy resin increased 190% and 55%, respectively. Those changes were attributed to the outstanding thermal and mechanical properties of polyimide, and more impor tantly to formation of semi-interpenetrating polymer networks composed by the epoxy net-work and linear PAA.